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現任理事長
江國寧 Dr. Kuo-Ning Chiang個人照
姓名 江國寧 Dr. Kuo-Ning Chiang
現任


Chair Professor,
National Tsing Hua University

IEEE Fellow, ASME Fellow, STAM Fellow

Corresponding Member of Russian International Academy of Engineering

經歷

Education:

  • Ph.D., ME of Georgia Institute of Technology
  • M.S., ME of University of South Carolina
  •  B.S. National Cheng Kung University

Career:

  • Present:  Editor-in-Chief, Journal of Mechanics
  • Present:  Co-Editor-in-Chief, IEEE Transactions on Components, Packaging, and Manufacturing Technology
  • Present:  Chair Professor, National Tsing Hua University
  • Present:  Director, Advanced Packaging Research Center, NTHU
  • Present:  Adjunct Chair professor, Feng Chia University
  • Present:  Research Fellow, Microsystem center of ITRI
  • Present:  Award committee, IEEE-CPMT
  • ASME Fellow
  • STAM Fellow
  • IEEE Fellow
  • IEEE-CPMT Board of Governors
  • Corresponding Member of Russian International Academy of Engineering
  • Convener, Solid Mechanics Research Program, Ministry of Science and Technology
  • Vice President, Asia Liaison Committee of International Microelectronics and Packaging Society (ALC, IMAPS)
  • Director of National Center for High-Performance Computing
  • Chairman of IMAPS - Taiwan (2006-2012, International Microelectronics and Packaging Society)
  • Associate Editor, IEEE Transactions on Advanced Packaging
  • Associate Editor, Journal of electronic package - ASME Transactions
  • Associate Editor, Journal of Mechanics
  • Associate Editor, IEEE Transactions on Components and Packaging Technologies
  • Engineering Director of ERSO/ITRI (2003-2005)
  • Secretary-General of ASME Taiwan Section (2002-2005)
  • Chairman of Key Application Committee – ERSO/ITRI (2005)
  • Director of R&D Division, NCHC (1993-1998)
  • Board Member of IMAP (International Microelectronics and Packaging Society) - Taiwan
  • Board member of KingPak Technology Inc.
  • Board member of Argosy Research Inc.
​Awards and Honors
  • ​Distinguished Research Award (2003-2006, 2010-2013, 2015-2018 國科會傑出研究獎) – National Science Council, Taiwan (Counterpart of National Science Foundation, US)
  • Co-Editor-in-Chief, IEEE Transaction on Components, Packaging and Manufacturing Technologies (2011-present)
  • Editor-in-Chief, Journal of Mechanics (2011 – present)
  • Board of Governors, IEEE-CPMT (2013-2016)
  • Distinguished Professor of National Tsing Hua University, 2007-2013
  • Associate Editor, IEEE Transaction on Advanced Packaging (2008-2011)
  • Associate Editor, IEEE Transaction on Components and Packaging Technologies (2006-2011)
  • Associate Editor of Journal of Electronic Packaging – ASME Transactions, 2006-2011
  • Associate Editor of Journal of Mechanics, 2006-present
  • Significant Contribution Award for "Advanced Packaging Technologies", IEEE 2009  International Conference on Electronic Packaging Technology
  • Excellent Contribution Award for "Simulation and modeling of micro/nanoelectronics and systems", IEEE 2009 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems
  • Distinguished Scholar Research Project Award  – National Science Council, Taiwan, 2008-2010
  • Distinguished Industry-Academy Cooperation Award – National Tsing-Hua University, Taiwan, 2008
  • Best Paper Award, 2011 IEEE, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2011).
  • NXP Semiconductor Best Paper Award, 2008 IEEE, International Conference on Electronic Packaging Technology – High Density Packaging
  • Best Paper Award, 2008 IEEE, International Microsystems, Packaging, Assembly and Circuits Technology Conference – Electronic Materials and Packaging Technology.
  • Best Paper Award, 2007 IEEE, International Conference on Electronics Materials and Packaging (EMAP 2007) 
  • Best Paper Award, 2007 IEEE, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2007)
  • Best Paper Award (2005) – ANSYS Conference
  • Excellent Journal Paper Award (1998) – “On the Optimal Topological Design of Plate/Shell Like Structures for Frequency Response Optimization Problems”
  • Best Paper Journal Award (1997) – “An Application of Coupled Finite Element Method/Boundary Element Method to The Computation of Structural Acoustic Response for Submerged Elastic Structures”
  • Honorary General Program Chair, IMPACT2012,2013 (International Microsystems, Packaging, Assembly and Circuits Technology Conference)
  • General Program Co-Chair, IMPACT2010 (International Microsystems, Packaging, Assembly and Circuits Technology Conference, IEEE/IMAPS)
  • General Program Chair, IMPACT2010 (International Microsystems, Packaging, Assembly and Circuits Technology Conference, IEEE/IMAPS)
  • General Co-Program Chair, IMPACT2006 International Conference (IEEE/IMAPS)
  • General Co-Program Chair, IMPACT2007 International Conference (IEEE/IMAPS)
  • General Co-Program Chair, IMPACT2008 International Conference (IEEE/IMAPS)
  • General Co-Program Chair, IMPACT2009 International Conference (IEEE/IMAPS)
  • General Co-Program Chair, EMAP2009 (International Conference on Electronic Materials and Packaging, IEEE/IMAPS)
  • General Co-Program Chair ICEPT2006,2007  (International Conference on Electronic Packaging Technology, IEEE)
  • Technical Program Chair, IMPACT2006   (IEEE/ASME/IMAPS)
  • International Technical Committee, EuroSimE2004, 2005, 2006, 2007-2013 (IEEE)
  • International Liaison, ITherm2004, 2006, 2008, 2010, 2012 International Conference(IEEE)
  • Technical committee, EPTC2004-2013 (IEEE)
  • Plenary Speaker, 2008 IEEE International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2008)
  • Plenary Speaker, 2006 IEEE, International Conference on Electronic Packaging Technology (ICEPT2006)
  • Keynote Speaker, 2004 IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE2004)
  • Keynote Speaker, 2005 International Conference on Computational & Experimental Engineering and Sciences
  • Plenary Speaker, ANASYS2008
  • Served as the session chair in IEEE conferences more than 30 times
  • First Section Chair and Secretary-General of ASME-Taiwan Section, 2000-2003
  • Chairman of International Microelectronic and Packaging Society (IMAPS) – Taiwan Chapter, 2006-present
  • President of Taiwan Microelectronic and Packaging Society, 2006-present
  • Valued Reviewer in 2009, Journal of Sensors and Actuators A
  • General Program Chair – ANSYS2008
  • Director, Advanced Packaging Research Center, NTHU, 2005-present
  • Technical Committee of ASME Electronic & Photonic Packaging Division, 2009-present
  • Founder and Secretary-General of Chinese Computer-Aided Engineering Association, 1996
  • Chairman of Key Application Committee, ITRI/Electronics Research and Service Organization, 2004-present
  • Editorial Advisory Board, Journal Sensor Letters, 2001
電話 03-574-2925
傳真 03-5745377
Email knchiang@pme.nthu.edu.tw
地址 30013新竹市光復路二段101號‧國立清華大學‧動機工程學系